Cadence SPB OrCAD 16.60.055 Hotfix | 1.6 Gb
Cadence Design Systems Ltd., a world-renowned provider of EDA software, has released update (HF55) for Cadence SPB OrCAD 16.60, software a comprehensive package design of electronic circuits, analog and digital simulation, IC design of programmable logic and custom circuits, as well as the development and preparation for the production of printed circuit boards.

Cadence Design Systems, Inc., a leader in global electronic design innovation, launched the Cadence OrCAD 16.6 design solution with new features, enhanced customization capabilities, and 20 percent simulation performance improvements that provide customers a shorter, more predictable path to product creation.
This latest release offers numerous improvements to tool usability and performance, but at the heart of 16.6 are three key benefits: enhanced miniaturization capabilities, timing-aware physical implementation and verification for faster timing closure, and the industry's first electrical CAD team collaboration environment for PCB design using Microsoft SharePoint technology.
DATE: 08-14-2015 HOTFIX VERSION: 055
CCRID PRODUCT PRODUCTLEVEL2 TITLE
1378035 ADW TDA Team Design Option: The part_table.ptf file is not updated for the modified parts
1394052 ALLEGRO_EDITOR INTERACTIV Edit - Mirror: Symbol preview attached to the mouse appears shifted compared to the symbol origin
1400866 PCB_LIBRARIAN EXPORT_OTHER Converting DE-HDL parts to OrCAD: Pin text size is incorrect
1407945 SIP_LAYOUT OTHER Layer compare not generating shapes correctly
1433910 ADW LRM Library Revision Manager fails to update the property values of the components in the given design
1435326 PCB_LIBRARIAN CORE When translating a .olb file into an HDL library symbol, symbol pin name shifts or disappears
1436070 SIG_EXPLORER SIMULATION Incorrect rise time for IBIS buffer when simulated in SigXplorer
1441985 CAPTURE SCHEMATIC_EDITOR Slow performance while working on a hierarchical design over the network
1442435 ALLEGRO_EDITOR OTHER Suppress Warnings related to Footprints if variable netrev_no_footprint_warnings is set
1443249 MODEL_INTEGRIT GUI Model Integrity does not show version information
1450135 ASI_SI OTHER Linked differential signal waveform of SigNoise report is not displayed in SystemSI viewer
1450287 SCM B2F Importing a DE-HDL design with a split symbol(s) in SCM does not import the complete symbol(s)
1451085 FLOWS PROJMGR Project Manager: The Copy Project function is using the same "session_name" in the new project as the source project
1451227 RF_PCB BE_IFF_IMPORT RF-PCB IFF Import: Modifications made in Advanced Design System (ADS) are not saved
1452134 ALLEGRO_EDITOR SHAPE Void on internal layer at 0,0 when the drill has an offset, and no padstack is defined for the internal layer
1452250 ALLEGRO_EDITOR PARTITION Cannot import a partition in Workflow Manager
1455420 SCM SCHGEN System Connectivity Manager: Unable to generate correct document schematic
1456043 APD STREAM_IF Generating stream data: No wirebond layers in the stream file if you flatten geometry and merge overlapping polygons
1458049 CONCEPT_HDL OTHER Reference to last used variant db has moved in the cpm file
About Cadence Design Systems, Inc.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.
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